| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that it takes time to repair a printed circuit board since it is impossible to keep a fixed surface temperature of the printed circuit board by discharging a temperature, used for preliminarily heating the printed circuit board and for heating a component, to the outside. SOLUTION: A repair device is provided with a support part for indicating at least the peripheral part of a printed circuit board in order to install the printed circuit board while floating the printed circuit board from the bottom face of a body, a warpage preventing pin installed movably between the printed circuit board and the bottom face of the device, a head composed of a suction member having a plurality of air holes, and a nozzle that is connected to a heating pump and a suction pump respectively while the other side of the nozzle, connecting the heating pump and the suction pump with each other, is connected to the head via a second heat source. A first heat source preliminarily heats the printed circuit board by its radiation heat. The head is configured so as to directly inject hot air, generated by the second heat source, to the printed circuit board during a heating mode via the nozzle and to suck a repair component during a suction mode. COPYRIGHT: (C)2009,JPO&INPIT
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