| 发明名称 |
EXPANSION SLOTS FOR THE THERMOMECHANICAL RELIEF OF AN ELECTRICAL CONTACT |
| 摘要 |
The aim of the invention is to thermomechanically relieve a layer stack which consists of an insulation foil and a flat strip conductor. According to the invention, elongate expansion slots are provided in the vicinity of the through contacts through the insulation foil. |
| 申请公布号 |
WO2009010457(A3) |
申请公布日期 |
2009.04.30 |
| 申请号 |
WO2008EP59058 |
申请日期 |
2008.07.11 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT;SCHWARZBAUER, HERBERT |
发明人 |
SCHWARZBAUER, HERBERT |
| 分类号 |
H01L23/538;H01L23/498 |
主分类号 |
H01L23/538 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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