| 摘要 |
A handling system for supporting a die-test is provided to reduce a test time by increasing the amount of the object to be tested by one time. A loading handler(110) of a handling system(100) loads a die on a wafer on the carrier board. The testing handler(120) supports the test of the dies loaded automatically or manually after the test handler complete loading. An unloading handler(130) unloads dies loaded to the wafer by grade. A control device(140) controls the loading handler, the testing handler, and an unloading handler. |
