ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DEPOSITION ON A WORKPIECE WITH THROUGH HOLES DURING PLATING
摘要
<p>A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.</p>
申请公布号
WO2009055116(A2)
申请公布日期
2009.04.30
申请号
WO2008US72287
申请日期
2008.08.06
申请人
FARADAY TECHNOLOGY, INC.;GEBHART, LAWRENCE, E.;TAYLOR, E., JENNINGS