POLISHING PAD, POLISHING PAD TILE AND METHOD OF MANUFACTURING THE POLISHING PAD

摘要

Disclosed are a polishing pad which is employed in CMP processes such as silicon wafers, plate glass for displays, and a method of manufacturing the polishing pad. The polishing pad comprises a polishing layer (1), and a fastener mounting layer (2) attached to a back side of the polishing layer (1), wherein coupling bores (4) are perforated from a surface of the polishing layer to a back side of the fastener mounting layer such that the polishing pad is fixed to a platen (J) by fasteners (F) inserted in the bores. The present invention adopts a fastener such as a bolt instead of an adhesive to attach a polishing pad to a platen, resulting in excellent adhesion therebetween and effectively preventing deterioration in polishing performance caused by lack of adhesion between the polishing pad and the platen and/or generation of scratch failures during a polishing process even by a worker substantially not highly skilled in the art.