| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide precursor composition or a photosensitive polyimide precursor composition which has properties, such as heat resistance, electric property, mechanical property, and noncombustibility, which are originally held by a polyimide resin, and is excellent in adhesion and flexibility, and which is ink for screen printing and suitable for heat-resistant electronic part application, an electronic part using the composition, and a film forming method. <P>SOLUTION: This polyimide precursor composition comprises at least one sort of aromatic tetracarboxylic acid dianhydrides, at least one sort of polyimide precursors obtained by polymerization with at least one sort of aromatic diamines, at least two sorts of additives (A) of benztriazole or its derivative, benzimidazole or its derivative or imidazole or its derivative, and a thiol compound and its derivative, and polar organic solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
