| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device discharging a waste liquid produced in treating a substrate to a waste liquid utility line or the like of a factory even when a treatment liquid such as a high-temperature SPM is used. SOLUTION: A high-concentration waste liquid generated in supplying a treatment liquid to a wafer W is introduced into a dilution tank 8 through a waste liquid pipe 72 and a high-concentration waste liquid introduction pipe 73, and a low-concentration waste liquid generated in washing the wafer W is introduced into a gas-liquid separation tank 9 through the waste liquid pipe 72 and a general waste liquid introduction pipe 74. The dilution tank 8 is configured to be supplied with cooling water for diluting and cooling the high-concentration waste liquid. A diluted waste liquid overflow pipe 83 is inserted in the bottom surface of the dilution tank 8. One end of the diluted waste liquid overflow pipe 83 is opened in a position of a predetermined height in the dilution tank 8. The other end of the diluted waste liquid overflow pipe 83 is connected to, for instance, a waste liquid utility line of a factory for installing this substrate treatment device therein. COPYRIGHT: (C)2009,JPO&INPIT
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