| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device and method for observing, inspecting, and distinguishing inspected and detected surface irregularities, shape defects, foreign matters, further, electrical defects, or the like, quickly and precisely using an identical device by applying white light, laser beams, and electron beams to a substrate surface having a circuit pattern in a semiconductor device, or the like, and to move to a position to be observed, to capture an image, and to automatically perform classification. SOLUTION: When specifying the position to be observed on a sample and applying electron beams for forming an image, based on the position information of a defect inspected and detected by other inspection apparatus, observation of electrical defects that can be conducted with a potential contract by designating electron beam irradiation conditions, detectors, detection conditions, and the like, according to the types of defects to be observed. The acquired images are automatically classified by an image processing section, and the results are added to a defect file to output. COPYRIGHT: (C)2009,JPO&INPIT
|
