| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly-reliable apparatus for filling up the through holes of a printed wiring board which never causes defects in the printed wiring board due to a temperature load, a thermal shock load, or the like. SOLUTION: The apparatus comprises a transport means (8) for transporting a substrate (1) in a predetermined transport direction (D), a roller (5) for applying a filler onto the surface (1b) of the substrate, a first squeegee (7A) which is in slide contact with the surface (1b) of the substrate (1) being transported at a first angle (θ1) and scrapes off a part of the filler applied by the roller (5), and a second squeegee (7B) which is in slide contact with the surface (1b) at a second angle (θ2), disposed downstream from the first squeegee (7A) in the transport direction and further scrapes off a remainder of the filler (3) which is left unscraped by the first squeegee (7A). The first and second angles (θ1 andθ2) are set to different values, with the first angle (θ1) being set to nearly 90°. COPYRIGHT: (C)2009,JPO&INPIT
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