| 摘要 |
PROBLEM TO BE SOLVED: To make a chip type solid electrolytic capacitor used for various electronic equipment compact. SOLUTION: The chip-type solid electrolytic capacitor comprises: an element stack of flat plate type elements 1 disposed having positive electrode portions 3 disposed alternately in reciprocal directions; a positive conductive member 5 joined to the lowest stage of the element stack; an external package 6 covering the element stack in a state where respective end surfaces of the positive electrode portions 3 of the element stack are exposed on opposite end surfaces and a negative conductive member 5 is exposed on a bottom surface; a base electrode 7 connected to the positive electrode portions 3 of the element stack exposed on the opposite end surfaces of the external package 6; and an external electrode 9 formed on the base electrode 7, the base electrode 7 comprising a zinc layer formed by cold spraying. Consequently, the number of components and the assembly man-hour can be decreased to make the chip-type solid electrolytic capacitor low-cost and compact, and respective electrodes are led out by the shortest distances to reduce ESL. COPYRIGHT: (C)2009,JPO&INPIT
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