| 摘要 |
PROBLEM TO BE SOLVED: To achieve an inspecting apparatus which collectively performs burn-in test for each semiconductor device formed on a semiconductor wafer under uniform temperature condition. SOLUTION: The inspecting apparatus, which inspects a semiconductor wafer 20 divided into a plurality of regions 20a, includes a voltage supplying part 12 which supplies inspecting voltage to the semiconductor wafer 20. The voltage supplying part 12 supplies the inspecting voltage to a semiconductor device 21 through an inspection electrode 24, and supplies heating element driving voltage which drives a heating element 22 through a heating element electrode 25, and obtains the temperature information of each region 20a through a sensor electrode 26, and controls the heating element driving voltage based on corresponding temperature information. COPYRIGHT: (C)2009,JPO&INPIT
|
