METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE METHOD

摘要

A printed circuit board and a manufacturing method thereof are provided to protect a circuit pattern of a substrate surface by forming an oxide layer through an anodizing process. A wiring pattern is formed in an external surface of a substrate. A metal layer is coated in the whole surface of the substrate(S110). The metal layer is removed from a chip mounting region in the surface of the substrate. A part of the wiring pattern that is the bonding finger is exposed(S120). The metal layer is anodized firstly(S130). The insulating layer is formed in the surface of the metal layer. The surface of the bonding finger is electrolytic-plated. The metal layer is anodized secondly(S140). The whole of the metal layer is made of the insulator. The wiring pattern does not include a plating lead line.