APPARATUS DEPOSITION OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A deposition apparatus of a semiconductor device and a manufacturing method of a semiconductor device are provided to improve a gap fill property of an insulation film for device isolation by performing a vibration process in forming a device isolation film. A hard mask film pattern(102) is formed on a semiconductor substrate(100). A trench is formed by etching a device isolation region of the semiconductor substrate and the hard mask film pattern. An insulation film(105) is formed on a whole structure including the trench. A void and a core inside the insulation film are removed by performing a vibration process. A device isolation film is formed by performing a flattening process in order to expose a top of the hard mask film pattern.