| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve downsizing of a whole device by efficiently radiating heat generated by a circuit component. <P>SOLUTION: A heat radiating member 7 formed of a material having a high thermal conductivity is thermally coupled to a case 1. Thereby, heat generated from a circuit component constituting a lighting circuit part 4 (in particular, a heat generating component with relatively large heating value such as a transformer T) is conducted from the case 1 to the heat radiating member 7, and efficiently radiated, as a result, the whole device can be downsized. <P>COPYRIGHT: (C)2009,JPO&INPIT |
