发明名称 CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductive pattern formation ink that can be stably ejected from a liquid droplet ejection head, to provide a conductive pattern having high reliability, and to provide a wiring substrate having high reliability and provided with the above conductive pattern. <P>SOLUTION: The conductive pattern formation ink is used for forming a conductive pattern on a base member using a liquid droplet ejecting method, and comprises a dispersion liquid prepared by dispersing metal particles in a water-based dispersion medium, and a drying suppressant in the dispersion liquid, the drying suppressant suppressing drying of the conductive pattern formation ink. The content of the drying suppressant is preferably 3 to 25 wt.%. The drying suppressant preferably comprises a polyhydric alcohol as a major component. The polyhydric alcohol preferably contains sugar alcohols. The polyhydric alcohol preferably contains at least two kinds of sugar alcohols. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009091383(A) 申请公布日期 2009.04.30
申请号 JP20070260407 申请日期 2007.10.03
申请人 SEIKO EPSON CORP 发明人 TOYODA NAOYUKI;KOBAYASHI TOSHIYUKI;ENDO SACHIKO
分类号 C09D11/00;C09D11/38;C09D11/52;H05K1/09;H05K3/10 主分类号 C09D11/00
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