PACKAGED TUNABLE SEMICONDUCTOR LASER STRUCTURE AND ITS FABRICATION

摘要

A packaged tuneable semiconductor laser (TSL) structure and a method of fabricating a packaged tuneable semiconductor laser (TSL) structure are provided. The TSL structure comprises a laser component, the laser component including a Micro-Electro-Mechanical Systems (MEMS) tuning structure for tuning a wavelength of a laser output signal from the laser component; and a modulator component provided separately from the laser component for modulating the laser output signal from the laser component; and an optical bench component for aligning the laser component and the modulator component for optical coupling therebetween.