METHOD OF CONNECTING AN ANTENNA TO A TRANSPONDER CHIP AND CORRESPONDING INLAY SUBSTRATE

摘要

A method and apparatus are provided for making radio frequency (RF) inlays. The RP inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.