| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY |
| 摘要 |
<p>INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.</p> |
| 申请公布号 |
SG151204(A1) |
申请公布日期 |
2009.04.30 |
| 申请号 |
SG20080067092 |
申请日期 |
2008.09.11 |
| 申请人 |
STATS CHIPPAC LTD |
发明人 |
PISIGAN JAIRUS LEGASPI;PUNZALAN JEFFREY D.;TAY LIONEL CHIEN HUI;CAMACHO ZIGMUND RAMIREZ |
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