LIGHT EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a high-output light emitting device which has a sub-mount whose light absorption is suppressed and a GaN-based LED chip flip-chip mounted on the sub-mount.

SOLUTION: The light emitting device 100 is an SMD (surface-mount) type LED and has the sub-mount 20 bonded to a bottom surface of a cavity (a cap-shaped portion) provided to a package 11 using an adhesive (not illustrated), and the GaN-based LED chip 30 is flip-chip mounted on the sub-mount 20. The sub-mount 20 has a transparent plate material 21 and two lead electrodes 22 partially formed on a front surface 21a thereof. A package electrode 112 and a lead electrode 22 provided to the sub-mount 20 are connected by a bonding wire 40 made of Au etc.

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