发明名称 CURVED CRACK-FORMING METHOD OF BRITTLE MATERIAL SUBSTRATE, AND BRITTLE MATERIAL SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of forming a crack along a curved possible dividing line. <P>SOLUTION: Covering means ML and MR mounted on the surface of the substrate have a band-like opening area R whose central line coincides with the possible dividing line CL, and shield the surface of the substrate other than the opening area so that a heat spot does not pass the same area when the heat spot HS is relatively moved along the possible dividing line. The heat spot HS having a wider width than the lateral width Wo of the opening area is relatively moved along the possible dividing line CL to cover a part of the opening area. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009090598(A) 申请公布日期 2009.04.30
申请号 JP20070265573 申请日期 2007.10.11
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 YAMAMOTO KOJI;INOUE SHUICHI;KUMAGAI TORU;ITSUDO TOGO;IMURA ATSUSHI;AKIYAMA NOZOMI
分类号 B28D5/00;B23K26/00;C03B33/09 主分类号 B28D5/00
代理机构 代理人
主权项
地址