发明名称 |
Method and apparatus to prewet wafer surface for metallization from electrolyte solutions |
摘要 |
The present invention improves the wetting between electrolyte and the wafer surface when they are put into contact by pre-implementing an adsorbed liquid layer on the entire front surface of the wafer just prior to the plating process. The pre-implementing adsorbed liquid layer is realized by transporting vaporized liquid molecules from vapor phase at elevated temperature (relative to wafer) and condensing them onto wafer surface.
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申请公布号 |
US2009107846(A1) |
申请公布日期 |
2009.04.30 |
申请号 |
US20070005538 |
申请日期 |
2007.12.27 |
申请人 |
ACM RESEARCH (SHANGHAI) INC. |
发明人 |
MA YUE;WANG DAVID |
分类号 |
C25D5/02;C23C16/00;C25D17/00;H01L21/02 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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