| 摘要 |
A semiconductor device and a manufacturing method thereof are provided to prevent generation of whisker in a plating film which does not contain a lead. A semiconductor device(1) comprises a semiconductor chip(5), a plurality of leads(3), a plating film, and a sealing body(2). The leads are connected to the semiconductor chip. The plating film is formed on a surface of the leads. A coefficient of linear expansion inside the plating film is smaller than a coefficient of linear expansion of copper. A lead frame is prepared. The semiconductor chip is mounted on a tap of the lead frame. A plurality of leads is connected to a wire. The sealing body seals the chip. |
