发明名称 METAL COMPLEX COMPOUND AND SUBSTRATE WITH METAL COMPLEX COMPOUND IMMOBILIZED THEREON
摘要 PROBLEM TO BE SOLVED: To provide a metal complex increasing the speed of electrons moving between its metal center and a substrate, and a substrate with a metal complex compound immobilized thereon employing the same. SOLUTION: Disclosed are a metal complex compound represented by formula (1), and a substrate with the metal complex compound bound thereto. In the formula, L1 represents a ligand comprising within its molecule a thiol group binding to a plurality of species of substrates and a terpyridyl group binding to a plurality of species of metallic elements, L2 represents terpyridine or a terpyridine derivative, and M represents a metallic element selected from Co, Cr, Cu, V, Fe, Ru, Os and Ni. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009091270(A) 申请公布日期 2009.04.30
申请号 JP20070261374 申请日期 2007.10.04
申请人 CANON INC 发明人 KUBO WATARU;MURAYAMA YOHEI;KACHI NOBUYUKI
分类号 C07D213/22;C07F15/06 主分类号 C07D213/22
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