| 摘要 |
A composite light-emitting-diode (LED) packaging structure having oppositely arranged chips comprises a first substrate with a first surface and a second surface, a second substrate with a first surface and a second surface, a first LED chip on the first surface of the first substrate, and a second LED chip on the first surface of the second substrate. The second surface of the second substrate and the second surface of the first substrate are packaged integrally in contact. |
