| 摘要 |
<p>It is disclosed a printed circuit board including a planar microwave integrated circuit in a high loss dielectric multilayer finding application in the implementation of a transceiver. The multilayer includes (figure 3) a thick copper sheet (met2) inserted between the first dielectric layer (diel1) and the remaining lamination (diel2, met3, diel3, met4). In the first dielectric layer (diel1) slots are opened (figure 4) for the insertion of bare microwave chips (13), glued to the copper underneath (met2) through conductive resin, and then bonded to the microstrips of the first conductive layout (met1). Single networks on alumina (13, 14) are housed in the slots as components in chips. Crowns of metallized through-holes (23), with lambda /8 minimum spacing one from the other, limit a same number of microwave circuit sections to prevent that they irradiate through the multilayer (figure 8). A lamination strip along one edge of the copper sheet is removed to facilitate the mechanical connection of the board and the coupling of the signal to a rectangular wave-guide (figure 9). <IMAGE></p> |
