| 摘要 |
A method for packaging an LED array module includes: forming at least one concave groove on a drive IC structure; arranging at least one LED array in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the at least one LED array via a printing, a coating, a stamping, or a stencil printing process; disposing the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.
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