PART BUILT-IN PRINTED WIRING BOARD, AND ITS MANUFACTURING METHOD

摘要

Provided is a printed wiring board, which is constituted by laminating a core layer (1) having a first wiring circuit (3) and an electronic part (7) mounted thereon and a wiring layer (12) having a second wiring circuit (14a). The electronic part (7) is soldered to connecting electrodes (3a) constituting the first wiring circuit (3). Solder jointed portions (6c) between the electronic part (7) and the electrodes (3a) are covered with resin-coated portions (9). A part fixing layer (11a) for fixing the electronic part (7) and the resin-coated portions (9) from their peripheries is formed in the core layer (1). An interlayer wiring portion (19) for connecting the first wiring circuit (3) and the second wiring circuit (14a) is formed in the core layer (1) and the wiring layer (12). Thus, the printed wiring board having the semiconductor parts therein can be efficiently manufactured by the simple process.