| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stacked semiconductor package composed by stacking a plurality of semiconductor chips with electrodes, for which insulating layers are formed at the sides of the plurality of semiconductor chips and the plurality of semiconductor chips are electrically connected through the insulating layers, easily and inexpensively. <P>SOLUTION: The method for manufacturing the stacked semiconductor package where the plurality of semiconductor chips with the electrodes are stacked includes: a process of forming the insulating layers at portions of a wafer corresponding to sides of the plurality of semiconductor chips when obtaining the plurality of semiconductor chips by working the wafer; and a process of forming wiring over the insulating layers at the portions equivalent to the sides of the plurality of semiconductor chips and electrically connecting the plurality of semiconductor chips through the electrodes. <P>COPYRIGHT: (C)2009,JPO&INPIT |
