| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder reference substance having a uniform distribution of atoms, and a method for fabrication thereof. SOLUTION: The method includes a step (S10) of weighing respectively Pb-free solder material powders containing tin as a base material and a compound including a material to be measured, a step (S20) of mixing and stirring them until two kinds of materials are homogeneously dispersed to form a mixture, and a step (S30) of pressing the mixture to mold it. The Pb-free solder material powders contain a substance containing at least one element selected from a group consisting of Ag, In, Cu, Zn, Bi, Sb and Ge. The compound includes at least one element from a group consisting of Pb, Cd, Cr, Hg, As, Se and Zn, and at least one element of inorganic metal, organic metal and inorganic metallic complex, and does not include the element which contained in the substance. COPYRIGHT: (C)2009,JPO&INPIT
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