| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer holding device highlyadhesively holding even a large-diameter, thin and ribbed wafer with no damage. SOLUTION: The device includes: a substrate mounting part onto which the semiconductor wafer with the rib formed on its outer peripheral edge is mounted; and a clamping means providing an electrostatic chuck on the substrate mounting part and applying pushing force onto the outer peripheral edge of the semiconductor wafer where the rib is formed. A central area of the substrate mounting part is protruded to have a raised stepped form. Application of the pushing force by the clamping means brings a lower end surface of the rib into contact with a one-step-lowered flat surface of the substrate mounting part to actuate the electrostatic chuck mechanism to bring a device structure part into facial contact with an upper surface of the protruded part to be adsorptively held. COPYRIGHT: (C)2009,JPO&INPIT |
