发明名称 METHOD OF CLEANING TRANSPARENT DEVICE IN A THERMAL PROCESS APPARATUS, THERMAL PROCESS APPARATUS AND PROCESS USING THE SAME THERMAL PROCESS APPARATUS
摘要 A method of cleaning a transparent device in a thermal process apparatus, wherein the transparent device is disposed in a chamber of a thermal process apparatus, and the transparent device includes a wafer holder for carry a wafer disposed under the transparent device, and an energy source output device disposed above the transparent device in the chamber, is provided. The method of the present invention includes performing a surface treatment step to clean a surface of the transparent device.
申请公布号 US2009107527(A1) 申请公布日期 2009.04.30
申请号 US20070931757 申请日期 2007.10.31
申请人 UNITED MICROELECTRONICS CORP. 发明人 WANG YU-YUNG;WU SHIN-LONG;LIANG CHAO-HU;LIN SHENG-YAO;SHIH HUI-SHEN;CHIEN YU-FANG
分类号 B08B5/00;B08B7/00;B08B13/00 主分类号 B08B5/00
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