发明名称 METHOD AND APPARATUS FOR THE PRODUCTION AND CONTROL OF PLATES OR WAFERS FOR ELECTRONICS
摘要 <p>Method for the production and control of plates (12) for electronics comprising a first step in which a plate (12) is positioned, by means of positioning means (34), in a loading station (16); a second step in which the plate (12) is disposed in a deposition station (18) associated with a unit (20) for depositing metal, or other material, in which the metal is deposited on the plate (12), in order to generate on the plates (12) metal tracks, according to a pre-determined and desired topological disposition; a third step in which the plate (12) is disposed in an exit station (24) and a detection means (30) is activated so as to detect the presence of defects in the plate (12); and a fourth step in which the plate (12) is discharged from the exit station (24). In the first step the detection means (30) is activated to identify defects in the plate (12) disposed in the loading station (16). In the second step the deposition unit (20) is activated in order to deposit the metal on the plate (12) when in the first step the detection means (30) has not detected any defect in the plate (12).</p>
申请公布号 WO2009053784(A1) 申请公布日期 2009.04.30
申请号 WO2008IB00501 申请日期 2008.03.05
申请人 BACCINI SPA;BACCINI, ANDREA 发明人 BACCINI, ANDREA
分类号 G05B19/418 主分类号 G05B19/418
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