发明名称 |
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF |
摘要 |
Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of second circuit electrodes are formed on a major surface of a second circuit board so that the first circuit electrodes are electrically connected with the second circuit electrodes in such a manner that the first and second circuit electrodes face each other. The circuit connecting material contains an adhesive composition, a conductive particle, and a plurality of insulating particles containing one or both of a polyamic acid particle and a polyimide particle. |
申请公布号 |
KR20090042829(A) |
申请公布日期 |
2009.04.30 |
申请号 |
KR20097004318 |
申请日期 |
2007.08.06 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TATSUZAWA TAKASHI;KOBAYASHI KOUJI;FUKUSHIMA NAOKI;KOBAYASHI TAKANOBU;ITO AKIHIRO |
分类号 |
C09J11/08;H01R4/04;H05K1/14 |
主分类号 |
C09J11/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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