发明名称 CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF
摘要 Disclosed is a circuit connecting material for connecting a first circuit member wherein a plurality of first circuit electrodes are formed on a major surface of a first circuit board with a second circuit member wherein a plurality of second circuit electrodes are formed on a major surface of a second circuit board so that the first circuit electrodes are electrically connected with the second circuit electrodes in such a manner that the first and second circuit electrodes face each other. The circuit connecting material contains an adhesive composition, a conductive particle, and a plurality of insulating particles containing one or both of a polyamic acid particle and a polyimide particle.
申请公布号 KR20090042829(A) 申请公布日期 2009.04.30
申请号 KR20097004318 申请日期 2007.08.06
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TATSUZAWA TAKASHI;KOBAYASHI KOUJI;FUKUSHIMA NAOKI;KOBAYASHI TAKANOBU;ITO AKIHIRO
分类号 C09J11/08;H01R4/04;H05K1/14 主分类号 C09J11/08
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