| 摘要 |
PROBLEM TO BE SOLVED: To provide a COF board which is high in connection reliability while increasing packaging density. SOLUTION: A COF board 1 includes a base insulating layer 2; and an inner lead 8 formed on the insulating layer 2, and electrically connected to an IC chip. The inner lead 8 is formed of a first inner lead 12 extended to a longitudinal direction and a second inner lead 13 extended to the longitudinal direction with a longitudinal length L4 shorter than longitudinal length L3 of the first inner lead 12, and a plurality of first inner leads 12 are arranged with intervals in the width direction, and a plurality of second inner leads 13 are arranged so that an overlapped section 14 where the second inner leads 13 are overlapped when the mutually adjacent first inner leads 12 are projected in the width direction and a non-overlapped section 15 in which the second inner leads 13 are not overlapped can be formed between the mutually adjacent first inner leads 12 in the width direction. A dummy lead 16 is formed in the non-overlapped section 15. COPYRIGHT: (C)2009,JPO&INPIT |
