| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a wiring board, which forms a protruding paste of a desired height without a printing faulty, to enhance an interlayer connection reliability. SOLUTION: The substrate for the wiring board comprises a releasable resin film 4 on at least one face of an insulating substrate 2 and a metal layer 3 on a face opposite to the insulating substrate 2 of the releasable resin film 4. COPYRIGHT: (C)2009,JPO&INPIT
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