| 摘要 |
A conductive pattern formation ink capable of forming a conductive pattern while preventing occurrence of disconnection thereof due to thermal expansion of a ceramic molded body, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern on a ceramic sintered body, wherein the ceramic sintered body with the conductive pattern is produced by the steps of applying the ink onto a ceramic molded body to obtain a pre-pattern on the ceramic molded body, and subjecting the ceramic molded body with the pre-pattern to a degreasing and sintering treatment. The ink contains a water-based dispersion medium, metal particles dispersed in the water-based dispersion medium, and a disconnection preventive agent composed of an organic matter and contained in the water-based dispersion medium, the disconnection preventive agent having a function of providing such a property that the pre-pattern can be deformed according to thermal expansion of the ceramic molded body due to the degreasing and sintering treatment to the pre-pattern, to thereby prevent occurrence of disconnection of the conductive pattern.
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