| 摘要 |
The invention relates to an optoelectronic sub-assembly that comprises: a housing (105), a cap (110) that is transparent in at least one area and for at least one light wavelength, said cap being assembled to the housing via a seal (150, 155, 160, 165) and bearing conductive tracks (109) flush with the surface of the cap oriented towards the housing, or inner surface, and at least one optoelectronic component (115) connected to the inner surface of the cap by metal microbeads (106) connected to conductive tracks on the cap, wherein each said optoelectronic component implements at least one wavelength for which an area of the cap opposite the optoelectronic component is transparent, a tight seal (114) between the cap and the housing, at least one electric connection conveying the signals from the optoelectronic component and extending through the body of the housing from the inside of the housing. |
