A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
申请公布号
WO2009055767(A2)
申请公布日期
2009.04.30
申请号
WO2008US81278
申请日期
2008.10.27
申请人
TRS TECHNOLOGIES, INC.;JIANG, XIAONING;HACKENBERGER, WESLEY, S.;SNOOK, KEVIN, A.
发明人
JIANG, XIAONING;HACKENBERGER, WESLEY, S.;SNOOK, KEVIN, A.