ELECTRONIC CIRCUIT PACKAGE

摘要

An electronic circuit package(1) has a thin-film circuit(3) integrated with the ceramic substrate(2). The thin-film circuit(3) includes at least two passive circuit elements joined by an integrated electrical interconnect. At least one active electronic component(4) is mounted on the ceramic substrate(2) without any dielectric material between the active electronic component(4) and the ceramic substrate, and is electrically connected with the integrated thin-film circuit(3).