| 摘要 |
A communication device and a manufacturing method thereof are provided to have a size of a micro type and to integrate devices with high density by mounting a bare-die inside a substrate. A substrate of a communication device(100) includes a first substrate part(110), a second substrate part(120), and a third substrate part(130). A land(114) and a first wire bonding land(115a) for a bare-die are formed on a top surface of the first substrate part. The second substrate part is arranged on the first substrate part on which the bare-die is formed. An opening part(A) is formed on a center part of the second substrate part. The bare-die is positioned inside the opening part. The second substrate part comprises a second bottom substrate(120a) and a second top substrate(120b). The third substrate part covers the second substrate part, and includes at least one via pattern(133) and a land(131). |
