| 发明名称 |
FLIP CHIP SEMICONDUCTOR DEVICE AND PROCESS OF ITS MANUFACTURE |
| 摘要 |
A semiconductor die and method of making it are provided. The die includes a first via extending through the entire thickness of the die and a first via electrode disposed inside the via electrically connecting an electrode at a top surface of the die with another electrode disposed at a bottom surface of the die.
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| 申请公布号 |
WO2007038342(A3) |
申请公布日期 |
2009.04.30 |
| 申请号 |
WO2006US37104 |
申请日期 |
2006.09.22 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION;MA, LING |
发明人 |
MA, LING |
| 分类号 |
H01L23/04;H01L21/00;H01L21/44;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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