发明名称 TREATMENT METHOD AND TREATMENT SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a treatment method and a treatment system which can effectively prevent the diffusion of a treatment gas from a treatment chamber. SOLUTION: Using a treatment system 100 provided with: a treatment chamber 31 performing prescribed gas treatment to the substrate W to be treated in a vacuum; an exhaust apparatus evacuating the treatment chamber 31; and a vacuum spare chamber 5 connected to the treatment chamber 31 via a switchgear G and held in a vacuum, when the substrate W is treated in the treatment chamber 31 with a halogen-containing gas, thereafter, the switchgear G is opened, and the substrate W is carried to the vacuum spare chamber 5, directly before the opening of the switchgear G, the inside of the treatment chamber 31 is evacuated by the exhaust apparatus, so as to make the pressure in the treatment chamber 31 lower than the pressure in the vacuum spare chamber 5, and, at the point of time in which the differential pressure between the treatment chamber 31 and the vacuum spare chamber 5 is made the fixed one or more, while continuing the evacuation, an inert gas is fed into the treatment chamber 31. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009091665(A) 申请公布日期 2009.04.30
申请号 JP20080332529 申请日期 2008.12.26
申请人 TOKYO ELECTRON LTD 发明人 NARISHIMA KENSAKU;TADA KUNIHIRO;TAKAHASHI TAKESHI
分类号 C23C16/44;C23C16/455;C23C16/54;H01L21/3065;H01L21/677 主分类号 C23C16/44
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