| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which attains a structure of lower cost wherein both sides of an IGBT element which is electrically connected to a signal terminal are placed between a pair of heat sinks, and substantially the entire part of the device is molded with mold resin. <P>SOLUTION: Two IGBT elements 10 of a rectangular shape are provided, and each IGBT element 10 includes a pad arrangement unit 12, consisting of pads 10a to 10e for signals of multiple kinds at two sides of an outer peripheral portion, by which two pads 10a to 10e of the same kind for the signals are provided for one IGBT element 10. The pads 10a, 10c of the same kind for the signals are electrically connected each other by a wire 71 between mutual IGBT elements 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
