发明名称 |
HEAT TREATMENT METHOD AND APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment method and apparatus which can thermally and uniformly treat even members as processing targets including materials having different light absorption characteristics when the processing members are thermally treated by illuminating the member with lamp light. SOLUTION: In the heat treatment method, members as processing targets including at least two types of materials having different absorption characteristics of light in visible and infrared light ranges are illuminated with light which is emitted from a discharge lamp and which is passed through a filter unit for removing part of the light having predetermined wavelengths according to the different light absorption characteristics. The filter unit comprises selective reflecting mirrors for reflecting at least part of ultraviolet or visible light to pass light having a wavelength range other than the wavelengths of the ultraviolet or visible light therethrough or absorbing the light. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009094404(A) |
申请公布日期 |
2009.04.30 |
申请号 |
JP20070265637 |
申请日期 |
2007.10.11 |
申请人 |
ADVANCED LCD TECHNOLOGIES DEVELOPMENT CENTER CO LTD |
发明人 |
SASAKI ATSUSHI |
分类号 |
H01L21/26;H01L21/20;H01L21/265;H01L21/336;H01L29/786 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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