| 摘要 |
PROBLEM TO BE SOLVED: To provide a through-hole structure for improving reliability by providing excellent solder wicking. SOLUTION: The through-hole structure in a printed circuit board 1 is characterized in that a through-hole 2 is electrically isolated into a first part 8 connected with a conductor and a second part 7 in the other part by providing an isolation slot 4. Accordingly, even when the conductor has a large area, heat of solder 9 is no longer transferred to the conductor at the time of soldering process and thereby excellent solder wicking can be provided in the soldering process to assure reliable connection. COPYRIGHT: (C)2009,JPO&INPIT
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