A method of encapsulation comprises the steps of: (a) treating microbial microcapsules with a material to be encapsulated in a substantially anhydrous liquid medium containing a polar aprotic solvent having a dielectric constant greater than 35 under conditions to permit encapsulation of the material, and (b) subjecting the product of step (a) to a substantially aqueous liquid. The preferred solvent is dimethyl sulfoxide (DMSO). The method of the invention is useful for encapsulating hydrophobic and/or high molecular weight materials in yeast.
申请公布号
WO2009053711(A2)
申请公布日期
2009.04.30
申请号
WO2008GB03615
申请日期
2008.10.27
申请人
THE UNIVERSITY OF MANCHESTER;TIRELLI, NICOLA;KILCHER, GIONA;CIAMPONI, FEDERICA