SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMICONDUCTOR CHIP

摘要

The semiconductor chip (1) has a support (3) with two support surfaces (31,32), and a semiconductor body (2) with semiconductor layer sequence. The semiconductor layer sequence has an active area (21) for the generation of radiation. The semiconductor body by is fixed by a connecting layer (4) to the support and number of reflecting or scattering elements (7) are formed between the latter support surface and the active area. A permeable contact layer (61) containing transparent conductive oxide-material is formed for radiation produced within the active area : An independent claim is also included for a method of manufacturing semiconductor chip.