发明名称 |
HIGH THERMALLY CONDUCTIVE ALUMINUM NITRIDE SINTERED PRODUCT |
摘要 |
<p>The high thermal conductive aluminum nitride sintered body according to the present invention has: a thermal conductivity of 220 W/m €¢ K or more; and a three point bending strength of 250 MPa or more; wherein a ratio (I Al 2 Y 4 O 9 /l AlN ) of X-ray diffraction intensity (I Al 2 Y 4 O 9 ) of Al 2 Y 4 O 9 (201 plane) with respect to X-ray diffraction intensity (l AIN ) of aluminum nitride (101 plane) is 0.002 to 0.03. According to the foregoing structure, there can be provided an aluminum nitride sintered body having a high thermal conductivity and excellent heat radiating property.</p> |
申请公布号 |
EP1695948(A4) |
申请公布日期 |
2009.04.29 |
申请号 |
EP20040799819 |
申请日期 |
2004.11.18 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOSHIBA MATERIALS CO., LTD. |
发明人 |
KOMATSU, MICHIYASU;MIYASHITA, KIMIYA |
分类号 |
C04B35/581;C04B35/638 |
主分类号 |
C04B35/581 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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