BUMP STRUCTURE WITH MULTIPLE LAYERS AND METHOD OF MANUFACTURE

摘要

A multi layer bump structure and a manufacturing method thereof are provided to secure a space for driving a micro structure formed on a surface of a base substrate. A bump structure includes a first layer(15) and a second layer(14). The first layer is electrically connected to a bottom surface of a protective substrate(16). The second layer is electrically connected to the first layer, and is contacted on a surface of a base substrate(11). The first layer and the second layer are made of one or more metal having a high conductive property. A micro structure(12) is formed on a surface of the base substrate. The base substrate is coupled in a protective substrate, and is mounted. A bottom surface of the protective substrate is electrically connected to the first layer.