发明名称 |
Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board |
摘要 |
<p>The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board.</p> |
申请公布号 |
EP2048211(A3) |
申请公布日期 |
2009.04.29 |
申请号 |
EP20080017744 |
申请日期 |
2008.10.09 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NONAKA, TAKAHIRO;DAIGAKU, NORITSUGU;NAKAYAMA, JUNICHI |
分类号 |
C09J7/02;C09J7/04;C09J9/02;C09J11/02;C09J11/04;C09J11/06;C09J11/08 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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