发明名称 Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board
摘要 <p>The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board.</p>
申请公布号 EP2048211(A3) 申请公布日期 2009.04.29
申请号 EP20080017744 申请日期 2008.10.09
申请人 NITTO DENKO CORPORATION 发明人 NONAKA, TAKAHIRO;DAIGAKU, NORITSUGU;NAKAYAMA, JUNICHI
分类号 C09J7/02;C09J7/04;C09J9/02;C09J11/02;C09J11/04;C09J11/06;C09J11/08 主分类号 C09J7/02
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